| 1. | The energy release rate can also be established experimentally from measuring the compliance of the cracked body .
能量释放率也可用实验方法测量裂纹体的柔度而建立起来。 |
| 2. | Fracture energy release rate in functionally graded materials
功能梯度材料裂纹能量释放率 |
| 3. | Energy release rate
能量释放率 |
| 4. | Energy release rate and bifurcation angles of dynamic electroelastic for piezoelectric materials with
压电材料反平面运动裂纹的能量释放率与分叉角 |
| 5. | Test method for plane - strain fracture toughness and strain energy release rate of plastic materials
塑料平面应变裂缝强度和应变能量释放速率测试方法 |
| 6. | Standard test methods for plane - strain fracture toughness and strain energy release rate of plastic materials
塑料材料平面应变断裂韧性和应变能量释放率的标准试验方法 |
| 7. | By a model which is based on the constitutive relation of the material and energy release rate , expressions are developed
利用本构关系并建立模型，得出了裂纹扩展速度表达式，初步解释了实验结果。 |
| 8. | While it is known that glc the critical energy release rate based on the energy balance method should have the same effect as kic in depicting the fracture of concrete
而基于能量平衡方法推出的临界能量释放率g _ ( ic ) ，在分析研究混凝土断裂中应同k _ ( ic )具有同样的效果。 |
| 9. | Using these specimens , the relatively long time of crack growth process is obtained , calculating energy release rate is relatively simple and the modeling of these specimens is easy
双梁试件在实验中能观测到的扩展过程持续时间比较长；在计算能量释放车时，计算方法简便；模型结构相对简单。 |
| 10. | The stress intensity factor ( sif ) and the strain energy release rate were simulated with different pre - crack length for the cases with no - flow underfill and with capillary - flow underfill
本文第六章用断裂力学方涪和有限元模拟分析了填充不流动胶芯片断裂问题，计算了芯片的应力强度因于k和能量释放率g 。 |
